Events
High-Power Laser Ablation IX (HPLA IX) is an international scientific conference focused on advances in high-power laser ablation and laser-matter interaction research. It is part of a long-running series of symposia that bring together researchers, engineers, and industry professionals working on fundamental science, applications, and technologies related to the interaction of intense laser pulses with matter.
Overview
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Name: High-Power Laser Ablation IX
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Dates: 16–18 March 2026
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Location: Santa Fe, New Mexico, United States
This ninth installment in the series continues the tradition of highlighting state-of-the-art research, experimental findings, modeling, and emerging applications of laser ablation and high-power laser technologies. The conference is usually organized under the umbrella of SPIE, an international society for optics and photonics.
Purpose and Scope
HPLA IX serves as a forum where scientists and engineers from academia, research institutions, and industry share recent results and discuss future directions in topics such as:
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Laser ablation and pulsed laser deposition for material processing and thin-film growth
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Fundamental laser-matter interactions, including theory and simulations
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High-power and ultrashort laser technologies and challenges in scaling peak and average powers
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Directed energy applications, including defense and propulsion concepts
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Emerging laser-enabled applications such as micro-/nano-fabrication, additive manufacturing, and biomedical tools
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Laser materials processing, including shock applications, surface modification, and plasma dynamics
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Poster sessions and discussions that span a broad range of related topics
The program features keynote talks, invited and contributed papers, poster presentations, and panel discussions on cutting-edge research, from fundamental physics to industrial and societal applications.
Example Topics Covered at HPLA IX
Some of the specific areas addressed at the 2026 meeting include:
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Pulsed laser deposition (PLD) and MAPLE (Matrix-Assisted Pulsed Laser Evaporation) for materials synthesis
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Ultrafast laser processes for precise micromachining and surface engineering
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Laser-driven particle acceleration and plasma physics
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High-power laser technologies and beam delivery systems
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Applications in additive manufacturing, photovoltaics, and sensors
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Laser-assisted biomedical diagnostics and device fabrication
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Space propulsion concepts based on beamed energy or laser ablation mechanisms
Community and Impact
HPLA conferences are significant in the fields of optics, photonics, materials science, and laser engineering because they:
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Promote cross-disciplinary exchange between physics, engineering, and applied sciences
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Highlight new experimental techniques, simulation methods, and applications of high-power lasers
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Provide a venue for networking, collaborations, and knowledge transfer across academia and industry
Overall, High-Power Laser Ablation IX is designed for researchers and professionals interested in the science and technology of laser-matter interactions, especially where high laser powers and precision processing are involved.
Conference Chair
Claude R. Phipps
Photonic Associates, LLC (United States)
Conference Chair
Vitaly E. Gruzdev
The Univ. of New Mexico (United States)
Program Committee
Victor V. Appolonov
A. M. Prokhorov General Physics Institute of the RAS (Russian Federation)
Program Committee
Michel Boustie
Ecole Nationale Supérieure de Mécanique et d’Aérotechnique (France)
Program Committee
Erik Brambrink
European XFEL GmbH (France)
Program Committee
Nadezhda M. Bulgakova
HiLASE Ctr. (Czech Republic)
Program Committee
Eric W. Davis
The Aerospace Corp. (United States), Ctr. for Astrophysics, Space Physics & Engineering Research, Baylor Univ. (United States)
Program Committee
Fabio Di Teodoro
Raytheon Co. (United States)
Program Committee
Eniko Gyorgy
Institut de Ciència de Materials de Barcelona (Spain)
Program Committee
Richard F. Haglund
Vanderbilt Univ. (United States)
Program Committee
Victor H. Hasson
Envisioneering, Inc. (United States)
Program Committee
Hideyuki Horisawa
Tokai Univ. (Japan)
Program Committee
Andrey A. Ionin
P. N. Lebedev Physical Institute of the RAS (Russia)
Program Committee
Tatiana E. Itina
Lab. Hubert Curien, Univ. of Saint-Etienne, CNRS (France)
Program Committee
Andreï V. Kanaev
Lab. des Sciences des Procédés et des Matériaux (France)
Program Committee
Wolfgang Kautek
Univ. Wien (Austria)
Program Committee
Kimiya Komurasaki
The Univ. of Tokyo (Japan)
Program Committee
Thomas K. Lippert
Paul Scherrer Institut (Switzerland)
Program Committee
Julie A. Mikula
NASA Ames Research Ctr. (United States)
Program Committee
Gérard A. Mourou
Lab. pour l’Utilisation des Lasers Intenses, École Polytechnique (France), Univ. of Michigan (United States)
Program Committee
Ross Muenchausen
Los Alamos National Lab. (United States)
Program Committee
Leik N. Myrabo
Lightcraft Technologies, Inc. (United States)
Program Committee
José Luis Ocaña
Univ. Politécnica de Madrid (Spain)
Program Committee
Kevin Parkin
Parkin Research, LLC (United States)
Program Committee
Johannes D. Pedarnig
Johannes Kepler Univ. Linz (Austria)
Program Committee
Joseph R. Peñano
U.S. Naval Research Lab. (United States)
Program Committee
Baerbel Rethfeld
Rheinland-Pfälzische Technische Univ. Kaiserslautern-Landau (Germany)
Program Committee
Yuri A. Rezunkov
Research Institute of Optoelectronic Instrumentation (Russian Federation)
Program Committee
Thierry Sarnet
Ctr. National de la Recherche Scientifique (France)
Program Committee
Stefan Scharring
Deutsches Zentrum für Luft- und Raumfahrt e.V. (Germany)
Program Committee
Klaus Sokolowski-Tinten
Univ. Duisburg-Essen (Germany)
Program Committee
Rongqing Tan
Institute of Electronics, Chinese Academy of Sciences (China)
Program Committee
Olivier P. Utéza
Lab. Lasers, Plasmas et Procédés Photoniques (France)
Program Committee
Anthony R. Valenzuela
U.S. Army Research Lab. (United States)
Program Committee
Laurent Videau
CEA-DAM Ile-de-France (France)
Program Committee
Leonid V. Zhigilei
Univ. of Virginia (United States)
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